Nvidia and TSMC Celebrate First Nvidia Blackwell Wafer Produced in the US (blogs.nvidia.com)

NVIDIA and TSMC marked a milestone as the first NVIDIA Blackwell wafer was produced at TSMC’s Phoenix (Arizona) fab, signaling that Blackwell has reached volume production on U.S. soil. NVIDIA CEO Jensen Huang and TSMC officials ceremonially signed the wafer, underscoring a push to onshore the critical infrastructure powering AI “factories.” The announcement highlights a strategic move to strengthen U.S. supply chains, create local high-tech jobs, and secure domestic capacity for the accelerators that run modern AI workloads. Technically, the wafer—the base substrate for semiconductors—will undergo layering, patterning, etching and dicing before becoming ultra-high-performance Blackwell GPUs optimized for AI inference, offering gains in performance, energy efficiency and ROI. TSMC Arizona is set up to manufacture chips across advanced nodes (2nm, 3nm and 4nm) and other products like Apple’s A16-class chips, supporting applications in AI, telecom and high-performance computing. NVIDIA also plans to use AI, robotics and digital-twin tools to design and operate new U.S. fabs. For the AI/ML community, this onshoring reinforces capacity resilience, shortens supply chains for cutting-edge GPUs, and signals broader industrial investment in scaling next-generation model training and deployment.