OKI Develops 124-Layer PCB Technology (www.oki.com)

Oki Circuit Technology has announced the development of groundbreaking 124-layer printed circuit board (PCB) technology aimed at enhancing wafer inspection equipment for next-generation AI semiconductors. This innovation, which represents a 15% increase in layer count over the conventional maximum of 108 layers, is crucial for supporting high bandwidth memory (HBM) applications that demand rapid data transfer between graphics processing units and memory. The new design maintains a thickness of 7.6 mm, leveraging ultra-thin materials and cutting-edge manufacturing processes to achieve greater density and precision. The significance of this advancement lies in its potential to facilitate the continued evolution of AI and semiconductor technologies. As AI applications become increasingly data-intensive, the efficiency of memory and processing chip integration is paramount. OKI's focus on high-performance PCBs also demonstrates its commitment to the future growth areas, including aerospace, defense, and next-generation communications. The company plans to establish mass production capabilities by October 2025, marking a substantial step forward in semiconductor manufacturing and inspection technology. This technology will be showcased at PCB East 2025 in Massachusetts, further highlighting OKI's role in driving innovation in the AI/ML ecosystem.