Microsoft-backed startup could dissipate 10kW GPUs, its founder confirms (www.techradar.com)

Corintis, a Microsoft-backed startup, says its in-chip microfluidic cooling can deliver roughly 10x the heat removal of conventional solutions and handle GPUs dissipating on the order of 10 kW. Microsoft confirmed the approach has been tested on live servers running core services, with company engineers saying the added thermal margin translates into software-visible performance headroom, overclocking potential and the ability to enable 3‑D stacked chip architectures that aren’t thermally feasible today. Corintis has raised $24M in Series A funding and claims it can scale production to more than one million microfluidic cold plates annually by 2026. This matters because cooling is the primary limit as AI accelerators climb from today’s ~400 W–1 kW GPUs (Nvidia H100 ≈700–800 W; next-gen GB200 >1 kW) toward much higher power densities. Unlike block-style copper cold plates, microfluidic designs route coolant precisely inside or across hotspots, potentially unlocking far higher-power chips and denser packaging for cloud and edge deployments. Key caveats: independent validation and manufacturability at data-center scale remain unresolved, and transitioning from lab demos to broad adoption involves supply, reliability and integration hurdles—even as major vendors already pivot toward liquid cooling.