🤖 AI Summary
Taiwan’s PSMC has joined forces with Intel and SoftBank to develop a new memory technology tailored for AI and high-performance computing applications, signaling a significant shift in the memory chip landscape. This collaboration highlights the urgent need for innovative memory solutions amid soaring demand driven by the AI boom, as existing technologies struggle to keep pace. The partnership aims to introduce “Z-Angle Memory” (ZAM), which seeks to enhance capacity, power efficiency, and data transfer speeds beyond the current High Bandwidth Memory (HBM) offerings.
The initiative involves a well-defined division of labor, with SoftBank’s Saimemory managing design and intellectual property, Intel focusing on memory architecture, and PSMC along with Shinko Electric Industries handling pilot production. Set to complete prototype development by 2027 and commercial production by 2029, ZAM is anticipated to deliver game-changing advantages, including a potential 40-50% reduction in power consumption and the ability to pack up to 512 GB per chip. This effort could disrupt the dominance of Samsung, SK hynix, and Micron, establishing PSMC as a key player in a new AI memory supply chain and fostering greater competition in the industry.
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