Arm's owner and Intel say their Z-Angle Memory, HBM-rival, will hit the market in 2029 - but I hope it won't be another Optane/3D-Xpoint, which caused Micron to lose millions (www.techradar.com)

Intel and SoftBank have announced a partnership to develop Z-Angle Memory, a promising stacked DRAM architecture set to target AI and high-performance computing by 2029. Prototypes are expected by 2028, with an ambitious goal of achieving two to three times the capacity of current high-bandwidth memory (HBM) products while reducing power consumption by 40-50%. This new technology is based on Intel's past research into multi-layer DRAM stacks and is designed to improve bandwidth density—critical for large-scale AI data centers where energy use impacts operational costs. The significance of this development lies in its potential to revitalize the semiconductor landscape, especially in Japan, which once led global DRAM production before losing ground to competitors like Samsung and SK Hynix. By investing approximately $19 million into the prototype phase, SoftBank aims to bolster domestic semiconductor capabilities while Intel seeks to re-establish its role in advanced memory solutions. However, skepticism remains within the industry due to the historical challenges faced by alternative memory technologies like Intel’s Optane, which resulted in substantial financial losses. As Z-Angle Memory moves forward, it will need to navigate the complexities of scale, yield, and competitive landscape to achieve commercial success.